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P/N: K606 Copper Plate, for AMD K6-2/K6-III 500MHz Up
Key Specifications/Special Features
- For AMD K6-2/K6-III 500MHz up
- Copper plate for 60% faster heat conduction from CPU's die area
- Patent pending for bonded fin punch press process
- Use 99.95% up Aluminum to increase 15% more thermal conduction rate
- 1/3 less weight than other coolers
- 40% more dissipation area and low wind resistance
- The unique clip design to install upon the CPU steel shell
- Specification
- CPU surface temp.(oC)(T): 69.0oC / 70.6oC / 73.0oC
- T (oC)(Tj - Ta): 24.0oC / 25.6oC / 28.0oC
- Power (Watts): 45.6oW / 49.9oW / 54.0oW
- Thermal resistance R: (oC/W)(T/Watts): 0.526oC/W / 0.513oC/W / 0.519oC/W
- Ralted voltage/ rated current: 12V / 0.10 AMP
- Fan size / rated speed: 50 x 50 x 10 (mm) / 4200rpm
- Fan type: Nidec D05X-12TS(M)
- Air flow: 15.18 cfm / 0.43m3/mm
- Fan safety: CE / UL / TUV
- Noise: 28.0 (dBA)
- Heat sink material: aluminum alloy 1050
- Heat sink dimension: 120 x 58 x 40 (mm)
- Fan + heat sink weight: 221 (g)
Export Market
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Адреса и контакты:
Neng Tyi Precision Industries Co Ltd
No 23
Wu Chuan Third Road
Wu Ku Hsiang
Taipei
Taiwan
Tel: (886 2) 22901499 Ext. 209
Fax: (886 2) 22901497
Email Address(es):nengtyi@asiansources.com
nengtyid@ms14.hinet.net
Сайт: http://www.asiansources.com/nengtyi.co
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